Other products
Low Pressure RF Sputtering System (HVS-02 / HVS-03)
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Features
It is also possible to form a thin film on a 10-2Pa pedestal through the
use of a sputtering gun compatible with high vacuum. Can be placed up to
five-dimensional sputtering gun at a maximum.
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Specification
- Deposition chamber
- Low pressure RF sputtering gun
- RF control power supply
- Load-lock system
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- Ultimate pressure
Substrate size
Substrate heating
Substrate heating temperature
Substrate rotation mechanism
Z axis movement mechanism
- Target size
Rotating shutter mechanism
- Ultimate pressure
Substrate transfer
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- 6.5×10-6Pa
φ2-inch x 1 (HVS-02)
φ3-inch x 1 (HVS-03)
Resistance heating system
MAX.700℃
Max.20rpm
±20mm
- 2-inch
- 300W, 13.56MHz, auto tuning function
- 6.5×10-5Pa
Manual transfer rod system
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